The ERSA HR550 is a powerful Hybrid Rework System, 3.9 KW.

Desoldering, placement and soldering of all types of surface mounted devices (SMD) – up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.

Features of the Ersa HR550

Highly efficient 1.500 hybrid heating head

Large-area IR bottom heating in 3 heating zones (2.400 W)

Integrated vacuum pipette for component removal and placement

Highly accurate placement with integrated force sensor

Enhanced Visual Assistant (EVA)

Computer aided component placement

Process control and documentation via software HRSoft 2

Suitable for the use of the Dip&Print Station


These variety of features make the Ersa HR550 an excellent piece of equipment.

Are you looking for more information about the Ersa HR550? Please contact Blundell today and one of our knowledgeable team will be able to advise further.


Machine enquiry

  • Please note that we can only deal with enquiries for equipment installed for use within the UK.

Dimensions (W x D x H) in mm573 x 765 x 545/747 (heating head down/up)
Weight in kg 76
Antistatic Design (y/n Yes
Power Rating in W3,900
Nominal voltage in V AC230
Upper heating Hybrid emitter(900 + 600 W), 70 x 70 mm
Lower heating IR emitter(3 x 800 W), 390 x 270 mm
PCB size in mmfrom 20 x 20 to 382 x 300 (+x)
Component size in mmfrom 0.5 x 0.5 to 70 x 70
Operation Windows PC
Test symbolCE