HR 600/3P

High-precision rework of fine pitch and chip components

Technical Highlights:

  • High-precision axis system (X, Y, Z) and high-resolution cameras
  • Automated component placement as well as soldering and desoldering processes
  • Hybrid heating head with two heating zones
  • Large-area, powerful IR bottom heater in three zones
  • Non-contact temperature measurement with digital sensor
  • Three K-type thermocouple inputs for Accu-TC sensor
  • Effective component cooling with compressed air

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Technical Data
Dimensions (W x D x H) in mm 850 x 660 x 573
Weight in kg 65
Antistatic Design (y/n) yes
Power Rating in W 3,200
Nominal voltage in V AC 220 V - 240 VAC, 50-60 Hz, 16 A
Upper heating Hybrid spotlight 800 W, in two zones, 60 x 60 mm
Lower heating IR emitter (3x 800 W), 380 x 250 mm
Measuring channels 3x K-Typ, 1x IRS
Position laser Class II
PCB size in mm up to 390 x 300 mm (+x) up to 535 x 300 mm (+x) (0HR600/3PL)
Component size in mm Chip 01005 up to 60 x 60 mm
Axis accuracy up to +/- 25 µm
Placement camera, upper 5 MP GigE colour camera
Component camera, lower 5 MP GigE black-and-white camera
Usable working distance (typ.) 30-60 mm to top heater, 35 mm to bottom heater
Compressed air connection 6-10 bar (oil-free). ¼ inch quick coupling
Volume of air cooling approx. 105 l/min (@ 6 bar)
Test symbol CE
Operating software HRSoft 2 - suitable for Windows 8 and Windows 10
OptionReflow process camera: 10 MP, CMOS GigE color camera, 50 mm focal length, illumination 2x LED, adjustable