Windsor based Speedboard Assembly Services has enhanced its PCB assembly capabilities by adding an IBL BLC 509 Vapour Phase soldering machine. Vapour Phase affords much better control and stability over the soldering process compared with traditional heat tunnel reflow systems.
PCB’s soldered with Vapour Phase do not experience the high temperature differences that are typically produced during traditional reflow soldering which can cause component or board damage. The vapour phase process heats the PCB with a vapour of boiling Galden, an inert liquid which is ideal for the wetting of lead free alloys without risk of oxidation.
Neil Owen, Speedboard’s managing director comments: “High complexity and therefore high value PCB’s demand the use of alternative production techniques in order to maintain consistently high quality. Following our investment in Vapour Phase, we are able to tackle increasingly challenging projects for customers operating in sectors such as Industrial, Defence, Medical, Communications and Security, where stringent standards are demanding consistency and quality throughout the entire manufacturing process.”
For more information on IBL Vapour Phase Soldering machines call us on 02476 210270 or email email@example.com