VAC745 / VAC765

Void-free solder joints with highest quality

  • Maximum board sizes:
  • VAC745: 635 x 444mm
  • VAC765: 635 x 644mm
  • Special Features
  • 15″ touch Windows HMI Screen (Network Capability)
  • Vacuum process in the vapour phase for void-free soldering ( patented)
  • Automatic monitoring of vacuum process (pressure monitoring)
  • IPS Intelligent profilling system
  • TRS temperature recording and analysis softwa
  • Pilot mode (PCB- temperature recording and Analysis software)
  • ┬áPilot-mode (PCB-Temperatute controlled process

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Maximum Board Sizes:

VAC745: 635 x 444mm

VAC765: 765 x 644mm

Special Features:

  • 15″ Touch Windows HMI Screen (Network Capability)
  • Vacuum process in the vapour phase for void-free soldering (patented)
  • Automatic monitoring of vacuum process (pressure monitoring)
  • IPS Intelligent profiling system
  • TRS Temperature Recording and Analysis Software
  • Pilot-mode (PCB-temperature controlled process)