Available as single or dual shuttle system.
SAR1300 for milling and sawing of routed tab and scored PCBs
The operator manually places the multi-panel on the shuttle axis’ workpiece carrier. After closing the sliding cover, the shuttle axis moves into the machining position. The milling head automatically collects a corresponding tool from the tool magazine that is mounted on the shuttle and then performs automatic tool breakage and diameter monitoring.
A camera system located on the milling head (optional), determines the position of the multi-panel in the workpiece carrier and transfers the misalignment to the milling axis system and a corresponding position correction takes place. Multi-panel or PBC codes (bar code or data matrix code) are identified and verified by an optional automatic scanner. Then, with the corresponding milling program, the multi-panel is separated. If a SCHUNK-BDE data capture system is installed, relevant process data is provided in a log file and can be collected from an external customer-specific traceability system in the system. If equipped with a second shuttle axis on the right to make a double shuttle system, the second shuttle axis (on which a second workpiece carrier is mounted) is moved into the load position at the same time and can be loaded or unloaded by the operator.
After the separation process, the workpiece carrier is moved back into its loading position. In this position, the carrier is manually unloaded and reloaded by the operator once the slide cover has been opened.
Once the workpiece carrier has been reloaded, a new cycle can start. The dust produced when milling is extracted using the sucker system fitted on the milling head. The dust exhaust is fitted externally to the side or rear of the machine.