Ersa Ecoselect-4

Inline and batch selective soldering system for highest selective quality

Highlights Selective Soldering System Ersa ECOSELECT 4:

  • VERSAFLOW 4 technology
  • PCB size 508 x 508 mm
  • Roller conveyor
  • Power convection
  • y/z variable dual solder pots
  • Automatic nozzle activation
  • Up to two spray heads and flux tanks
  • Award-winning ERSASOFT 5 software
  • Flexibly integrable soldering system: inline or batch operation
  • Upgrade with independent flux module to a full inline machine
  • VERSACAM – solder wave height measurement “on the fly”


Machine enquiry


The Ecoselect-4 is a compact system that is perfectly suited for small  to medium-sized batches where flexibility is essential, featuring machine technology of the latest VERSAFLOW generation.

Its conveyor system is a high-quality roller conveyor offering a max. PCB size of 508 x 508 mm and can be used inline or in batch operation.

Another machine highlight is the new power convection heating, for example, which provides an optimal, homogeneous warm-up for complex boards. Like all Ersa selective soldering systems the it is equipped with a programmable precision spray fluxer with integrated spray control for precise and economical flux application in single spots or in tracks. A second spray head is available as an option.

Innovative machine operation with ERSASOFT 5

The new dual solder pot system of the VERSAFLOW 4 is also available for the ECOSELECT 4.

Both mini wave pots can be moved flexibly in Y/Z direction. Thus the machine operator can install solder nozzles with different diameters in order to quickly solder connectors or multi-pin devices with a large diameter nozzle while also having access to a very slim nozzle shape for joints which are difficult to reach.

The innovative and user-friendly ERSASOFT 5 software makes the machine operation even more intuitive. Through individual user interfaces, each group of operators receives, at a glance, the data and information required.

A further software highlight is the PiP technology (picture in picture) combined with a process monitoring camera.