Vapour phase is considered to be much better in terms of giving control and stableness through the soldering practice. The actual workings of the vapour phase process involve heating up the pcb through the vapour phase oven. The end result of the vapour phase soldering is the formation of alloys which do not have lead, which also reduces the chance of oxidation occurring.
The process is also available using IBL vapour phase. IBL is a patented form of technology known as ‘soft vapour phase (SVP.)’ This allows for maximum control in the vapour phasing process allowing many different soldering results to be achieved.