Vapour Phase Reflow Soldering
Vapour phase is considered to have process advantages over convection in terms of giving control and stability over the reflow cycle. The vapour phase process involve heating up the pcb through the Galden vapour, an inert medium. The end result of the vapour phase soldering is an assembly that has been reflowed with a uniform heat source and free of oxidation.
IBL hold the patent for the technology known as ‘soft vapour phase (SVP.)’ This provides maximum control during the reflow process allowing almost infinite variation of solder profiles, easily but custom configured to the specific soldering needs of any assembly.