VP-Mini & Jumbo Prototype Vapour Phase reflow
The machines are designed for reflow soldering in laboratory and prototype environments.
Ideal for processing small size, low quantity components and PCB’ s. Components such as QFPs, BGAs, Flip-Chips as well as hybrids can be re-flowed defect free with highest quality results.
VP Mini & Jumbo Features
Due the small size of the system it may be used at any place. Its simple fast set up ensures a rapid ready for use vapour phase reflow unit providing the ability to solder high quality assemblies’ defect free.
- Table-top model
- Top loader
- Window to observe the soldering process
- Suitable for BGA’s, Stacked Packages
- Oxygen Free Soldering
- Homogeneous temperature transmission on the complete assembly
- No overheating of components
A fume cabinet is recommended as shown just to remove any odor from the process. Fumes are harmless but can be unpleasant.
Energy supply (Single Phase) 220-240 Volt / 50-60 Hz
Power drawn Mini -1.000 W 5amp Jumbo 2,000W 10amp
System dimensions. Mini – 400 x 315 x 305 mm (L x W x H) Jumbo 605 x 385 x 450mm
Max. Solder product format Mini – 240 x 170 x 20 mm (L x W x H) Jumbo 430 x 230 x 20mm
Standard cycle time Mini – Approx. 10 Minutes Jumbo – 15 Minutes
Soldering time Approx. 60 – 120 Seconds (depends on products)
Process temperature (depends on medium type) 210 up to 240 °C
Weight Mini – 6 kg Jumbo – 15kg
Cooling Forced air cooling
Heat transfer medium GALDEN with the correct boiling temperature (max. 240 °C)
Medium basic filling quantity 450– 500 ml GALDEN