HR550 1

9 – HR550 Hybrid Guided Rework Centre

High precision repair process:

Desoldering, placement and soldering of all types of surface mounted devices (SMD) – up to 70 x 70 mm: BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF and miniature components with an edge length of min. 0.2 x 0.4 mm.

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  • Highly efficient 1.500 hybrid heating head
  • Large-area IR bottom heating in 3 heating zones (2.400 W)
  • Integrated vacuum pipette for component removal and placement
  • Highly accurate placement with integrated force sensor

    Dip & Print station for screen printing device contacts

  • Enhanced Visual Assistant (EVA)
  • Computer aided component placement
  • Process control and documentation via software HRSoft 2
  • Suitable for the use of the Dip&Print Station


Dimensions (W x D x H) in mm          573 x 765 x 545/747 (heating head down/up)
Weight in kg                                    76
Antistatic Design (y/n)                       Yes
Power Rating in W                            3,900
Nominal voltage in V AC                   230
Upper heating   Hybrid emitter           (900 + 600 W), 70 x 70 mm
Lower heating   IR emitter                   (3 x 800 W), 390 x 270 mm
PCB size in mm                                 from 20 x 20 to 382 x 300 (+x)
Component size in mm                       from 0.5 x 0.5 to 70 x 70
Operation                                         Windows PC
Test symbol                                        CE